Flake alumina micropowder benchmarked against PWA15 for gallium arsenide silicon wafer polishing

Flake Alumina Powder Comparable to PWA15 for Gallium Arsenide Wafer Polishing

PRODUCT/Product: Platelet Calcined Aluminum Oxide / Flake Alumina

DESCRIPTION/Product Introduction:

Platelet calcined alumina powder, also known as tabulated aluminum oxide grinding powder. It is named after its particle crystal structure being in the shape of scales/flat plates. The crystal form of flake alumina is α- Al2O3 has high hardness and grinding performance. In the electronics industry, polishing and polishing require high surface precision. To ensure precise grinding effects and yield, abrasive materials with sharp crystal shapes can no longer meet the requirements. The surface of the abrasive particles of flake/flat alumina is flat and smooth, and the diameter-to-thickness ratio of the particles can be adjusted by adjusting the synthesis method. Grinding semiconductor chips or other microelectronic components is less prone to scratches, greatly improving the yield of qualified chips. The production of platelet calcined alumina adopts a high-temperature calcined method to promote the lateral growth of crystals and form regular hexagonal powders with a tabulated structure. The suspension-treated aluminum oxide grinding powder of platelet shape gets a uniform particle size distribution. That ensures a fine grinding surface.

Flake alumina is also known as tabular alumina, named for its scale/flat plate-shaped particle crystal structure. The crystal form of flake alumina is α-Al2O3, which possesses high hardness and grinding performance. In the electronics industry, surface finishing requirements for polishing are highly precise. To ensure fine grinding results and product yield, abrasive materials with sharp crystal shapes can no longer meet the demands. The abrasive particles of flake/plate-like alumina have a flat and smooth surface, and the particle diameter-to-thickness ratio can be adjusted by modifying the synthesis method. When grinding semiconductor wafers or other microelectronic components, it is less likely to cause scratches, significantly improving the qualified yield of wafers. The production of flake alumina employs a high-temperature sintering method to promote lateral crystal growth, forming regular hexagonal powders with a flake structure. The flake alumina processed through washing and classification has a high degree of particle size concentration, contributing to consistency in the grinding surface.

CHEMICAL COMPOSITION/Chemical Composition:

PHYSICAL PROPERTIES/Physical Properties:

PARTICLE SIZE DISTRIBUTION/Particle Size Distribution:

APPLICATIONS/Application Scenarios：

l  Semiconductor industry: Grinding and polishing of single crystal silicon wafers, siliceous wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide). / Semiconductor industry: Grinding and polishing of single crystal silicon wafers, silicon-based wafers, piezoelectric quartz crystals, and compound semiconductors (gallium arsenide, indium phosphide).

l  Glass industry: Grinding and processing of crystal, quartz glass, picture tube glass screen, optical glass, LCD glass substrate, and piezoelectric quartz crystals./ Glass industry: Grinding and processing of crystal, quartz glass, cathode-ray tube glass screens, optical glass, LCD glass substrates, and piezoelectric quartz crystals.

l  Coating industry: Special coatings and plasma spraying fillers. / Coating industry: Special coatings and plasma spray fillers.

l  Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc. / Metal and ceramic processing industry: precision ceramic materials, sintered ceramic raw materials, high-end high-temperature coatings, etc.

PACKAGE/Packaging：

10kgs/Bag+20kgs/Carton+1Ton/Pallet / 10kg small bag + 20kg carton + 1 ton pallet